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[Program doc] aku6.1

Description: PLATFORM BUILDER FOR WINDOWS MOBILE 5.0、6.1,AKU FOR WM6.1 ,aku for windows mobile 6.1,aku 6.1 for windows mobile,开发平台,编译系统,带BSP包,有s3c2440,s3c2442,sc32442,s3c2416,s3c2450,s3c2451,s3c6400,s3c6410,pxa300,pxa310,pxa320,pxa312的WM BSP包,PDF文档,altas A4,Atlas3,AT643,ATLAS3,AT642,arm11的相关资料,并是WINDOWS MOBILE pb,适用于GPS,智能手机等相关领域，希望对你有帮肋的！
Platform: | Size: 1320434 | Author: testsb | Hits:

[Windows CE] SMDK2416

Description: smdk2416 wince source code/BSP -smdk2416 wince source code/BSP
Platform: | Size: 9048064 | Author: ssgstw | Hits:

[Windows CE] SMDK2450_WinCE50_PM_REL_0.03_080407

Description: s3c2450 bsp for wince 5.0 经验证,完全没问题-s3c2450 bsp for wince 5.0 certified, totally no problem
Platform: | Size: 12998656 | Author: dd | Hits:

[ARM-PowerPC-ColdFire-MIPS] aku6.1

Description: PLATFORM BUILDER FOR WINDOWS MOBILE 5.0、6.1,AKU FOR WM6.1 ,aku for windows mobile 6.1,aku 6.1 for windows mobile,开发平台,编译系统,带BSP包,有s3c2440,s3c2442,sc32442,s3c2416,s3c2450,s3c2451,s3c6400,s3c6410,pxa300,pxa310,pxa320,pxa312的WM BSP包,PDF文档,altas A4,Atlas3,AT643,ATLAS3,AT642,arm11的相关资料,并是WINDOWS MOBILE pb,适用于GPS,智能手机等相关领域，希望对你有帮肋的！
Platform: | Size: 1319936 | Author: aku_mobile | Hits:

[Windows CE] SMDK2450_WinCE50_PM_REL_0.04_080519

Description: s3c2450 bsp for wince 5.0 PM_REL_0.04_080519 经验证,完全没问题-s3c2450 bsp for wince 5.0 PM_REL_0.04_080519
Platform: | Size: 11004928 | Author: wangqiang | Hits:

[Other Embeded program] S3C2451_UM_REV0[1][1].30_20081020

Description: 三星2450的资料，很紧俏的文档哟。 非常的完整-Samsung 2450 data, it is tight yo documents
Platform: | Size: 5955584 | Author: 杨勇 | Hits:

[OS program] SMDK2450

Description: 三星2450平台的整个bsp包的源代码，可以编译成功-Samsung bsp entire 2450 platform source code package can be compiled successfully
Platform: | Size: 3931136 | Author: venson | Hits:

[ARM-PowerPC-ColdFire-MIPS] YLP2450_DVK_USER_CD_V13

Description: S3C2450开发板的全套光盘，包括OrCAD格式原理图、PADS格式封装库、BSP源码包、烧录下载工具和软件，用户手册，编程文档和芯片规格书等等。-S3C2450 development board complete set of CD-ROM format, including OrCAD schematics, PADS format package library, BSP source package, burn download the tools and software, user manuals, programming documentation and chip specifications and so on.
Platform: | Size: 33401856 | Author: cmosttl | Hits:

[Windows Mobile] SMDK2450_WM61.ZIP

Description: SMDK2450 windows mobile 6.1 BSP 对开发windows mobile 很有参考价值-For developing windows Mobile，Base on the S3C2450.
Platform: | Size: 2588672 | Author: 何君 | Hits:

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